Technical Program Committee Members
Technical Program Chairs
- Hiroshi Harada, NICT, Japan
- Marcos Katz, University of Oulu, Finland
- Ying-Chang Liang, I2R A-STAR, Singapore
- Seiichi Sampei, Osaka University, Japan
- Kei Sakaguchi, Tokyo Institute of Technology, Japan
TPC members
- Mohamed Abdallah, Texas A&M University at Qatar, Qatar
- Fumiyuki Adachi, Tohoku University, Japan
- Kiyomichi Araki, Tokyo Institute of Technology, Japan
- Huseyin Arslan, University of Florida, USA
- Edward Au, Huawei Technologies, China
- A. Rahim Biswas, Create-Net, Italy
- Timo Braysy, University of Oulu, Finland
- Milind Madhav Buddhikot, Alcatel-Lucent, USA
- Chan-Byoung Chae, Bell Laboratories, Alcatel-Lucent, USA
- Liang Ying Chang, I2R A-STAR, Singapore
- Tao Chen, VTT, Finland
- Xiang Chen, Tsinghua University, China
- Seungwon Choi, Hanyang University, Korea
- Panagiotis Demestichas, University of Piraeus, Greece
- Markus Dillinger, Huawei Technologies Duesseldorf, Germany
- Linda Doyle, Trinity College Dublin, Ireland
- Zhiyong Feng, Beijing University of Posts and Telecommunications, China
- Frank Fitzek, Aalborg University, Denmark
- Hiromasa Fujii, NTT docomo, Japan
- Takeo Fujii, University of Electro-Communications, Japan
- Yasunori Futatsugi, NEC, Japan
- Atilio Gameiro, University of Aveiro, Portugal
- Xiaoying Gan, Shanghai Jiao Tong University, China
- Yoshitaka Hara, Mitsubishi Electric, Japan
- Thomas Haustein, Fraunhofer Heinrich Hertz Institute, Germany
- Lajos Hanzo, Southampton University, UK
- Anh Tuan Hoang, I2R A-STAR, Singapore
- Masayuki Hoshino, Panasonic, Japan
- Ekram Hossain, University of Manitoba, Canada
- Honglin Hu, Shanghai Research Center for Wireless Communications, China
- Hai-Last Jiang, University of Alberta, Canada
- Eduard Jorswieck, Technical University Dresden, Germany
- Thomas Kaiser, Leibniz University of Hannover, Germany
- Chang-Joo Kim, ETRI, Korea
- Toshiaki Koike-Akino, Harvard University, USA
- Masahiro Koya, Hitachi Kokusai Electric, Japan
- Erik G. Larsson, Linkoping University, Sweden
- Won Cheol Lee, Soongsil University, Korea
- Husheng Li, The University of Tennessee, USA
- Pavel Loskot, Swansea University, UK
- Ivana Maric, Stanford University, USA
- Matinmikko Marja, VTT, Finland
- Joe Mittola, Stevens Institute of Technology, USA
- Klaus Moessner, University of Surrey, UK
- Lorenzo Mucchi, University of Florence, Italy
- Markus Dominik Mueck, Infineon Technologies, Germany
- Maurizio Murroni, University of Cagliari, Italy
- Nobuo Nakajima, University of Electro-Communications, Japan
- Haewoon Nam, Motorola, USA
- Dusit Niyato, Nanyang Technological University, Singapole
- Dominique Noguet, CEA LETI, France
- Yasutaka Ogawa, Hokkaido University, Japan
- Ozgur Oyman, Intel, USA
- Peter Popovski, Aalborg University, Denmark
- Venkatesha Prasad,Delft University of Technology, Netherlands
- Tony Q. S. Quek, I2R A-STAR, Singapore
- Zouheir Rezki, King Abdullah University of Science and Technology, Saudi Arabia
- Berna Sayrac, Orange-FTgroup, Frace
- Takashi Shono, Intel, Japan
- Pengbo Si, Beijing University of Technology, China
- Kandeepan Sithamparanathan, Create-Net, Italy
- John Strassner, Pohang Science and Technology University, Korea
- Noriharu Suematsu, Tohoku University, Japan
- Daisuke Takeda, Toshiba, Japan
- Vahid Tarokh, Harvard University, USA
- See-Ho-Ting, Nanyang Technological University, Singapole
- Kenta Umebayashi, Tokyo University of agriculture and technology, Japan
- Vaclav Valenta, ESIEE Paris and Brno University of Technology, France
- Christos Verikoukis, Telecommunications Technological Centre of Catalonia, Spain
- Sriram Vishwanath, University of Texas, USA
- Branka Vucetic, University of Sydney, Australia
- Xinbin Wang, Shanghai Jiaotong University, China
- Hsiao-Chun Wu, Louisiana State University, USA
- David Tung Chong Wong, I2R A-STAR, Singapore
- Kazuto Yano, ATR, Japan
- Seokhyun Yoon, Dankook University, Korea
- Hitoshi Yoshino, Softbank Mobile, Japan
- Honggang Zhang, Zhejiang University, China
- Jietao Zhang, Huawei Technologies, China
- Qi Zhang, Aarhus School of Engineering, Denmark
- Xing Zhang, Beijing University of Posts and Telecommunications, China
- Heather Zheng, University of California Santa Barbara, USA
- Yonghong Zeng, I2R A-STAR, Singapore